Samsung's Xi'an NAND flash memory plant completed expansion.

Infineon technologies inc. for its 1200 V TRENCHSTOP? IGBT7 series introduces a new current rating module. This makes the Easy 1B and 2B product families even more complete, and it is now possible to combine the latest c...

Today (10) South Korea LG Chemistry said it would invest 1.2 trillion won (about 7.3 billion yuan) to expand its battery production line in Nanjing, China, to cope with the surge in global demand for cylindrical batterie...

As early as May this year, Intel announced plans to expand its factories in Israel and submitted applications. Today, the Israeli government agreed to give 700 million shekels of government subsidies to Intel's proposed...

Jiwei news, wafer generation plant TSMC actively expand production, Daxin project operation benefits, this year received more than 5 billion orders from TSMC. Dagong not only received the new construction projects of pha...

As supply of 12 inch silicon wafers continues to be tight, major wafer manufacturers around the world, including Japan's Shenggao, Germany's Silitronic and Universal Wafers, have begun to expand production plans. In contrast, the mainland is also accelerating the development of 12 inch large silicon wafers. According to the current planning of domestic enterprises, it is estimated that the domestic 12-inch silicon wafer production capacity will reach 1.45 million wafers per month by 2020, covering domestic demand.

According to foreign media reports, according to foreign media reports, semiconductor wafer manufacturers worldwide wafers and South Korean local governments reached a cooperative factory expansion agreement, initially agreed to invest 480 billion won or the equivalent of 449 million US dollars, including 200 million US dollars of foreign direct The investment will be used to expand the production capacity of 12-inch silicon wafers and is expected to be completed by 2020. In response to this, Global Wafer Clarification stated that the possibility of expanding factories around the country is currently under investigation.

This week, according to the Yonhap news agency, Samsung Electronics announced that it has started using the second-generation 10nm process to produce 8Gb DDR4 particles, another iteration of technology after two years of the first-generation 10nm process.

NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.

AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.